• Samsung aims to mass produce 2nm process technology by 2025 and 1.4nm by 2027
• Samsung plans to more than triple its advanced node capacity by 2027
• Non-mobile applications including HPC and automotive are expected to exceed 50% of its foundry portfolio by 2027
• Samsung Foundry strengthens customer service capabilities of its partner ecosystem
Samsung Electronics, a global leader in advanced semiconductor technology, today announced a business strategy to strengthen its foundry business, introducing cutting-edge technologies at its annual Samsung Foundry Forum event.
With the significant growth in the high-performance computing (HPC), artificial intelligence (AI), 5/6G connectivity, and automotive application markets, the demand for advanced semiconductors has increased dramatically, making innovations in semiconductor process technology critical to the business success of foundry customers. important. To this end, Samsung has highlighted its commitment to bring its state-of-the-art process technology, 1.4 nanometers (nm), to volume production in 2027.
During the event, Samsung also outlined the measures its foundry business is taking to meet customer needs, including: △ foundry process technology innovation, △ process technology optimization for each specific application, △ stable production capacity, and △ providing customers with customized service.
“Technology development goals down to 1.4nm and foundry platforms specific to each application, as well as stable supply through continuous investment, are all part of Samsung’s strategy to ensure customer trust and support for their success,” Dr. Dr. said. Si-young Choi, president and head of foundry business at Samsung Electronics. “Working with our partners to achieve innovation for each customer has always been at the heart of our foundry services.”
Showcasing Samsung’s advanced node roadmap down to 1.4nm by 2027
As the company successfully puts the latest 3nm process technology into mass production, Samsung will further strengthen its gate-all-around (GAA) based technology and plans to launch a 2nm process in 2025 and a 1.4nm process in 2027.
While developing process technology, Samsung is also accelerating the development of 2.5D/3D heterogeneous integrated packaging technology to provide overall system solutions for foundry services.
Through continuous innovation, its microbump interconnected 3D package X-Cube will be mass-produced in 2024, and its bumpless X-Cube will be available in 2026.
By 2027, the share of HPC, automotive and 5G will exceed 50%
Samsung aggressively plans to target high-performance and low-power semiconductor markets such as HPC, automotive, 5G, and the Internet of Things (IoT).
To better meet customer needs, this year’s Foundry Forum introduced bespoke and tailored process nodes. Samsung will enhance its GAA-based 3nm process support for HPC and mobile devices, while further enriching the 4nm process dedicated to HPC and automotive applications.
Specifically for automotive customers, Samsung is currently offering embedded non-volatile memory (eNVM) solutions based on 28nm technology. To support automotive-grade reliability, the company plans to further expand the process node by launching a 14nm eNVM solution in 2024 and adding 8nm eNVM in the future. Samsung has been mass producing 8nm RF after 14nm RF and is currently developing 5nm RF.
“Shell first” operation strategy, timely response to customer needs
Samsung plans to more than triple its advanced node capacity by 2027 from this year.
Including the new plant under construction in Taylor, Texas, Samsung’s foundry production lines are currently spread across five locations: Kiheung, Hwaseong, and Pyeongtaek in South Korea; and Austin and Taylor in the United States.
At the event, Samsung detailed its “Shell first” capacity investment strategy, which starts with building clean rooms regardless of market conditions. Since the cleanroom is readily available, fab equipment can be installed later and flexibly set up for future needs. Through the new investment strategy, Samsung will be able to better respond to customer needs.
Following the first line announced last year, investment plans for a new “Shell-First” line at Taylor and a potential expansion of Samsung’s global semiconductor production network were also introduced.
Expand SAFE Ecosystem and Strengthen Customized Services
Following the “Samsung Foundry Forum”, Samsung will hold the “Security Forum” (Samsung Advanced Foundry Ecosystem) on October 4th. New foundry technologies and strategies will be introduced with ecosystem partners including electronic design automation (EDA), IP, outsourced semiconductor assembly and test (OSAT), design solution partners (DSP) and cloud.
In addition to 70 partner presentations, the Samsung Design Platform team leader will introduce the possibility of applying Samsung processes, such as GAA and 2.5D/3DIC co-optimization of design technologies.
As of 2022, Samsung offers more than 4,000 IP with 56 partners, and is also working with 9 and 22 partners on design solutions and EDA, respectively. It also offers cloud services with 9 partners and packaged services with 10 partners.
Together with its ecosystem partners, Samsung provides integration services that support solutions from IC design to 2.5D/3D packaging.
Through its robust SAFE ecosystem, Samsung plans to identify new fabless customers through customized services that enhance performance, fast delivery and price competitiveness, while aggressively attracting new customers such as hyperscalers and startups.
Starting from the United States (San Jose) on October 3rd, Europe (Munich, Germany) on the 7th, Japan (Tokyo) on the 18th, and South Korea (Seoul) on the 20th, the “Samsung Foundry Forum” will be held in sequence, through which each region will be provided Introduce customized solutions. A recording of the event will be available online from the 21st for those unable to be present in person.